ITW Insulcast® RTVS 27 HTC Silicone Potting/Encapsulation Compound

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ITW Insulcast® RTVS 27 HTC Silicone Potting/Encapsulation Compound
Categories:	Polymer; Thermoset; Silicone; Silicone, RTV, Encapsulation Grade
Material Notes:	Insulcast® solutions are compounds designed for potting and encapsulating. RTVS 27 HTC is a low viscosity, UL94V-0 certified, reversion resistant silicone compound. The combination of low viscosity and high thermal conductivity makes the RTVS 27 HTC ideal for potting dense component packages requiring heat dissipation. Information provided by ITW Performance Polymers.
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Physical Properties	Original Value	Comments

Specific Gravity	1.96 g/cc	Uncured. Part B
	1.98 g/cc	Uncured. Part A
Viscosity	3300 cP	Part B; ASTM D1084
	6000 cP	Mixed, Part A, Part B; ASTM D1084
	8000 cP	Part A; ASTM D1084

Mechanical Properties	Original Value	Comments
Hardness, Shore A	60	ASTM D2240
Tensile Strength	500 psi	ASTM D412
Elongation at Break	60 %	ASTM D412

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+15 ohm-cm	ASTM D257
Dielectric Constant	4.0 @Frequency 1000 Hz	ASTM D150
Dielectric Strength	500 V/mil	ASTM D149
Dissipation Factor	0.0075 @Frequency 1000 Hz	ASTM D150

Thermal Properties	Original Value	Comments
CTE, linear	170 µm/m-°C
Thermal Conductivity	1.00 W/m-K
Maximum Service Temperature, Air	232 °C
Minimum Service Temperature, Air	-55.0 °C
Flammability, UL94	V-0

Processing Properties	Original Value	Comments
Cure Time	0.250 hour @Temperature 120 °C	option
	0.500 hour @Temperature 95.0 °C	option
	2.00 hour @Temperature 60.0 °C	option
	24.0 hour @Temperature 25.0 °C	option
Pot Life	1.00 min	Part A, Part B
Shelf Life	6.00 Month	Part A, Part B

Descriptive Properties
Color	Gray	part A, uncured
	Natural	part B, uncured
Mix Ratio by volume	1:1	Part A: Part B
Mix Ratio by weight	1:1	Part A: Part B

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