Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound

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Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled; Filled/Reinforced Thermoset
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. Exhibits exceptional reliability, excellent moldability, good release characteristics, low flash and rapid cure. This compound is especially formulated for automated molding equipment.
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Physical Properties	Original Value	Comments

Density	1.86 g/cc
Spiral Flow	38.0 cm	177°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75
Tensile Strength, Ultimate	83.0 MPa
Flexural Strength	124 MPa

Electrical Properties	Original Value	Comments
Dielectric Constant	3.8 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm
Dissipation Factor	0.0020 @Frequency 1000 Hz
Arc Resistance	180 sec

Thermal Properties	Original Value	Comments
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	90.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	155 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	170 - 190 °C	Molding temperature

**
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PCOOK309 / 21405

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