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Rulon Bearings

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Henkel Loctite® 3862 Thermally Conductive Potting
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes:
Thermally Conductive Bonders and Potters
Loctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or microprocessors and their heat sinks. Loctite offers a wide range of adhesive chemistries including silicones, acrylics and epoxies. Many processing options are available for curing these adhesives such as heat cure, activator cure, and UV light.

Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.

For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.

Loctite® 3862 Thermally Conductive Potting
A thermally conductive, potting compound for automotive electronic applications requiring thermal conductivity and thermal shock resistance. Suitable for Military Class H applications. Cure Type: Heat Bonding Type: 2-part epoxy (100:28)

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Physical PropertiesOriginal ValueComments
Viscosity <= 20000 cPMixed
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75
 
Thermal PropertiesOriginal ValueComments
CTE, linear 32.0 µm/m-°C
@Temperature 20.0 °C
Glass Transition Temp, Tg 153 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hour130ºC
 4.00 hour100ºC
Pot Life 1440 min
@Temperature 23.0 °C

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