Product Highlights:- Superior chemical resistance
- Very good flow properties
- Protects against fuels and solvents
- Outstanding mechanical strength properties
- Excellent electrical insulation properties
- Phenomenal thermal conductivity
Kohesi Bond KB 1151 S-1AO is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:30 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1151 S-1AO is uniquely formulated for protection against harsh chemicals, especially fuels and solvents. It contains no solvents or diluents, making it a 100% reactive system. It offers an extensive service temperature range of -50°C to +150°C. This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. It has superior electrical insulation properties and excellent thermal conductivity. Part A and Part B off-white in color. KB 1151 S-1AO is widely used in electronic, aerospace, chemical processing and specialty OEM applications where thermal conductivity resistance to solvents and fuels is critical. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
