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Chemically Resistant adhesives

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Park Aerospace Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.

Key Features and Benefits:

  • Lead-Free Assembly Compatible
  • Tg >190ºC, robust thermal stability
  • High Speed and Low Loss Properties
  • CAF Resistant
  • SI (Signal Integrity) option
  • High-Tg FR-4 processing

Applications/Qualifications:

  • Lead-Free Assemblies
  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • SIPs
  • MCM-Ls
  • Direct Chip Attach
  • Network Storage
  • Wireless Communications Infrastructure
  • High Speed Computing

Information provided by Park Electrochemical Corp.

Key Words: EP
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.90 g/cc50% Resin Content; Internal Method
Water Absorption 0.090 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 3400 ksiY; ASTM D3039
 4100 ksiX; ASTM D3039
Poissons Ratio 0.14Y; ASTM D3039
 0.16X; ASTM D3039
Peel Strength 8.70 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 9.20 pliafter solder float; IPC-TM-650.2.4.8
 9.30 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
 1.00e+14 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+12 ohmE - 24/125; IPC-TM-650.2.5.17.1
 1.00e+14 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant 3.6
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
 3.7
@Frequency 1e+10 Hz
Split Post Cavity
 3.7
@Frequency 1e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength 1470 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.0080
@Frequency 2.50e+9 Hz
Split Post Cavity
 0.0080
@Frequency 1e+10 Hz
Split Post Cavity
Arc Resistance 65 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.67 - 8.62 µin/in-°F
@Temperature -40.0 - 125 °C
X/Y; IPC-TM-650.2.4.41
 33.36 µin/in-°F
@Temperature 50.0 - 190 °C
Z-Axis Alpha 1; IPC-TM-650.2.4.41
 144.56 µin/in-°F
@Temperature 190 - 260 °C
Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 0.290 BTU/lb-°FASTM E1461
Thermal Conductivity 2.08 - 3.47 BTU-in/hr-ft²-°FASTM E1461
Glass Transition Temp, Tg 180 °CTMA; IPC-TM-650.2.4.24c
 190 °CDSC; IPC-TM-650.2.4.25c
 210 °CDMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature 370 °C5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)1IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)>60IPC-TM-650.2.4.24.1
Z Axis Expansion (%)3.650ºC to 260ºC; IPC-TM-650.2.4.41

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PPARK104 / 89376

Chemically Resistant adhesives

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