All-purpose, structural dielectric resin. High thermal and chemical resistance and RT cure. Processing: 100/12 ratio; Potlife: 45 min/20°C (68°F), 20 min/40°C (105°F), 10 min /60°C (140°F); mix at RT; cures in: 24 h/20°C (68°F), 2-3 h/60°C (140°F), 10-20 min/100°C (212°F). Applications: Laminating, small volume potting and impregnating. |
laminating, composites, potting, impregnating |