Epoxies, Etc 20-3301 Epoxy Potting Compound Thermal Shock and Cycling Resistant

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Epoxies, Etc 20-3301 Epoxy Potting Compound Thermal Shock and Cycling Resistant
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength. 20-3300 is ideal for high heat and thermal shock exposure. It has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Great choice for high voltage applications. 20-3300 has a convenient 1:1 mix ratio with an extended pot life. Features: Toughness over a wide temperature range Thermal shock resistance Long working time Chemical resistance RoHS and REACH compliant DOT Non-Hazardous Unfilled with easy to use mix ratio Information provided by Epoxies, Etc
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Physical Properties	Original Value	Comments

Specific Gravity	1.00 g/cc	Curing Agent
	1.10 g/cc	Resin
Water Absorption	<= 1.0 % @Time 605000 sec
Viscosity	2000 cP	Curing Agent
	5800 cP	Mixed
	12000 cP	Resin

Mechanical Properties	Original Value	Comments
Hardness, Shore D	60
Tensile Strength	1800 psi
Elongation at Break	100 %

Electrical Properties	Original Value	Comments
Volume Resistivity	1.50e+15 ohm-cm
Dielectric Constant	2.9 @Frequency 1e+6 Hz
Dielectric Strength	>= 440 V/mil
Dissipation Factor	0.010 @Frequency 1e+6 Hz

Thermal Properties	Original Value	Comments
CTE, linear	70.0 - 80.0 µm/m-°C
Thermal Conductivity	0.400 W/m-K
Maximum Service Temperature, Air	155 °C
Minimum Service Temperature, Air	-55.0 °C

Processing Properties	Original Value	Comments
Cure Time	1.00 - 2.00 hour @Temperature 80.0 °C
	1.00 - 2.00 hour @Temperature 80.0 °C

Descriptive Properties
Color	Transparent amber
Working Time	200 grams

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PFEPOX037 / 316714

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