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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy
Categories: Metal; Nonferrous Metal; Bismuth Alloy; Solder/Braze Alloy

Material Notes: Lowest melting point solder. Good fusible alloy used for lens blocking.

Information Provided by Indium Corporation

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Physical PropertiesOriginal ValueComments
Density 9.58 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 14.5
@Load 4.00 kg
2mm ball
Tensile Strength, Ultimate 41.3 MPa
Elongation at Break 120 %% elongation on 5.65 (sq. root Area) gauge length
Shear Strength 2.10 MPaShear Bond Holding Strength
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000430 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Heat of Fusion 39.8 J/g
CTE, linear 22.0 µm/m-°C
@Temperature 20.0 °C
Specific Heat Capacity 0.146 J/g-°CSolid
 0.184 J/g-°CLiquid
Thermal Conductivity 18.0 W/m-K
@Temperature 85.0 °C
Melting Point 70.0 °CEutectic
Solidus 70.0 °C
Liquidus 70.0 °C
 
Component Elements PropertiesOriginal ValueComments
Bismuth, Bi 50 %
Cadmium, Cd 10 %
Lead, Pb 26.7 %
Tin, Sn 13.3 %

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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NNIN06 / 18462

solder replacement adhesives

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