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Master Bond adhesives

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Materion eStainless® 240 20/60/20 H3 Temper Stainless/Copper Laminate
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: eStainless steel is a thermally conductive, fully formable clad laminate of stainless steel and copper (SUS/Cu/SUS). It is ideal as a high-conductivity replacement for stainless steel, allowing heat spreading functionality to be designed directly into the structure of devices. Integrated heatsinks made of eStainless clads reduce the need to add specialty thermal management solutions, saving both costs and internal device space. eStainless steels are typically used in consumer electronics devices to enhance the performance of components such as chassis, frames, EMI shields, brackets, and anywhere else that metals are used.

Information provided by Materion.

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Mechanical PropertiesOriginal ValueComments
Hardness, Vickers >= 320SUS
Flexural Yield Strength >= 761 MPa
Flexural Modulus 179 MPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000300 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 38.0 W/m-KZ
 240 W/m-KX-Y
 
Descriptive Properties
90° Bend Formability<2Longitudinal

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