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solder replacement adhesives

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Lucas-Milhaupt PREMABRAZE® 408 Gold-Copper Braze Alloy
Categories: Metal; Nonferrous Metal; Precious Metal; Gold Alloy; Solder/Braze Alloy

Material Notes: Premabraze 408 can be used on any of the common ferrous and non-ferrous base alloys. Due to its low and narrow plastic range, this alloy is a preferred choice in step brazing operations. Premabraze 408 exhibits excellent vacuum properties along with high corrosion and oxidation resistance properties. Premabraze 408 is a modified gold-copper alloy. It is generally used in reducing, vacuum, or inert atmosphere. It is a more ductile alloy than standard gold-copper alloys. The composition of the alloy allows for use in applications where braze filler metals low in volatile constituents are required.

Available forms: Wire, strip, engineered preforms, specialty preforms, powder and paste.

Information provided by Lucas-Milhaupt.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 13.79 g/cc
Density 0.499 lb/in³
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000131 ohm-cm13.2% IACS
 
Thermal PropertiesOriginal ValueComments
Melting Point 1535 - 1553 °F
Solidus 1535 °F
Liquidus 1553 °F
 
Processing PropertiesOriginal ValueComments
Processing Temperature 1553 - 1653 °FBrazing Range
 
Component Elements PropertiesOriginal ValueComments
Cadmium, Cd <= 0.0010 %
Carbon, C <= 0.0050 %
Copper, Cu 18.97 - 20.97 %Remainder
Gold, Au 59.5 - 60.5 %
Lead, Pb <= 0.0020 %
Other, each <= 0.0010 %High vapor pressure elements.
Other, total <= 0.010 %high vapor pressure elements (Including zinc, cadmium, and lead)
 <= 0.010 %Impurity elements
Phosphorus, P <= 0.0020 %
Silver, Ag 19.5 - 20.5 %
Zinc, Zn <= 0.0010 %
 
Descriptive Properties
ColorGold Red

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NLUCM9832 / 254777

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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