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Flame Retardant adhesives

Sumitomo Bakelite EPIALL 2061B-1 Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes: Epiall 2061B-1 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.

Information provided by Sumitomo Bakelite High Performance Plastics (sbhpp)
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.90 g/cc1.90 g/ccASTM D792
Apparent Bulk Density 0.900 g/cc0.0325 lb/in³Powder; ASTM D1895
Water Absorption 0.20 %
@Time 173000 sec		0.20 %
@Time 48.0 hour		ASTM D570
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cm0.0030 - 0.0050 in/inASTM D955
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 90.0 MPa13100 psiASTM D638
Flexural Strength 138 MPa20000 psiASTM D790
Flexural Modulus 15.9 GPa2310 ksiASTM D790
Compressive Strength 231 MPa33500 psiASTM D695
Izod Impact, Notched 0.370 J/cm0.693 ft-lb/inASTM D256A
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1e+6 Hz		3.8
@Frequency 1e+6 Hz		wet; ASTM D150
Dielectric Strength  >= 13.3 kV/mm
@Frequency 60 Hz		>= 338 kV/in
@Frequency 60 Hz		SS, wet
 >= 13.7 kV/mm
@Frequency 60 Hz		>= 348 kV/in
@Frequency 60 Hz		ST, wet
Dissipation Factor 0.016
@Frequency 1e+6 Hz		0.016
@Frequency 1e+6 Hz		wet; ASTM D150
Arc Resistance 180 sec180 secASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 29.0 µm/m-°C16.1 µin/in-°FASTM E831
CTE, linear, Transverse to Flow 41.0 µm/m-°C22.8 µin/in-°FASTM E831
Deflection Temperature at 1.8 MPa (264 psi) 165 °C329 °FPost Baked; ASTM D648A
Flammability, UL94 V-0
@Thickness 1.60 mm		V-0
@Thickness 0.0630 in
 
Descriptive Properties
UL Temperature Index130UL 746B

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PSUMIT152 / 193957

Flame Retardant adhesives




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