Copper Alloy, UNS C70240, H02 Temper, Flat Products

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Copper Alloy, UNS C70240, H02 Temper, Flat Products
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Temper: 1/2 Hard Fabrication Properties: Excellent Suitability – Soldering; Good Suitability – Capacity for Being Cold Worked, Capacity for Being Hot Formed Common Fabrication Processes: Forming and Bending; Stamping
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Physical Properties	Metric	English	Comments

Density	8.86 g/cc	0.320 lb/in³

Mechanical Properties	Metric	English	Comments
Hardness, Vickers	>= 200 @Load 3.00 kg	>= 200 @Load 6.62 lb
Tensile Strength	621 - 738 MPa	90000 - 107000 psi
	683 MPa	99000 psi	Typical
Tensile Strength, Yield	517 - 641 MPa	75000 - 93000 psi	0.2% Offset
	579 MPa	84000 psi	0.2% Offset, Typical
Elongation at Break	>= 5.0 %	>= 5.0 %
Tensile Modulus	128 GPa	18600 ksi
Modulus of Rigidity	48.21 GPa	6992 ksi	Calculated
Poissons Ratio	0.33	0.33

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.00000320 ohm-cm	0.00000320 ohm-cm	53% IACS

Thermal Properties	Metric	English	Comments
CTE, linear	16.9 µm/m-°C @Temperature 20.0 - 300 °C	9.41 µin/in-°F @Temperature 68.0 - 572 °F
Thermal Conductivity	17.4 W/m-K	121 BTU-in/hr-ft²-°F
Melting Point	>= 1060 °C	>= 1940 °F
Solidus	1060 °C	1940 °F

Component Elements Properties	Metric	English	Comments
Copper, Cu	94 - 98.3 %	94 - 98.3 %	As Balance
Iron, Fe	<= 0.10 %	<= 0.10 %
Lead, Pb	<= 0.050 %	<= 0.050 %
Manganese, Mn	0.010 - 0.20 %	0.010 - 0.20 %
Nickel, Ni	1.0 - 4.0 %	1.0 - 4.0 %
Silicon, Si	0.40 - 0.80 %	0.40 - 0.80 %
Silver, Ag	0.010 - 0.10 %	0.010 - 0.10 %
Zinc, Zn	0.30 - 0.80 %	0.30 - 0.80 %

Descriptive Properties
US EPA Registered Antimicrobial	Yes

References for this datasheet.

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MC70240x1 / 292399

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