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Master Bond adhesives

Copper Alloy, UNS C19720, HR02 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: 1/2 Hard and Stress Relieved

Fabrication Properties: Excellent Suitability – Capacity for Being Cold Worked; Capacity for Being Hot Formed

Typical Uses: Springs, electrical; Terminals, electrical

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Physical PropertiesMetricEnglishComments
Density 8.83 g/cc0.319 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 400 MPa58000 psi
Tensile Strength, Yield 331 MPa48000 psi0.2% Offset
Elongation at Break >= 9.0 %>= 9.0 %
Tensile Modulus 119 GPa17200 ksi
Modulus of Rigidity 45.5 GPa6600 ksi
Poissons Ratio 0.300.30
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000220 ohm-cm0.00000220 ohm-cm80% IACS
Magnetic Permeability 0.9990.999
 
Thermal PropertiesMetricEnglishComments
CTE, linear 17.3 µm/m-°C
@Temperature 20.0 - 300 °C
9.60 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.377 J/g-°C0.0900 BTU/lb-°F
Thermal Conductivity 26.7 W/m-K185 BTU-in/hr-ft²-°F
Melting Point 1069 - 1086 °C1956 - 1986 °F
Solidus 1069 °C1956 °F
Liquidus 1086 °C1986 °F
Annealing Point 349 - 549 °C660 - 1020 °F
 
Processing PropertiesMetricEnglishComments
Hot-Working Temperature 760 - 927 °C1400 - 1700 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 98.6 - 99.8 %98.6 - 99.8 %As Balance
Iron, Fe 0.050 - 0.50 %0.050 - 0.50 %
Lead, Pb <= 0.050 %<= 0.050 %
Magnesium, Mg 0.060 - 0.20 %0.060 - 0.20 %
Manganese, Mn <= 0.050 %<= 0.050 %
Nickel, Ni <= 0.10 %<= 0.10 %
Phosphorus, P 0.050 - 0.15 %0.050 - 0.15 %
Tin, Sn <= 0.20 %<= 0.20 %
Zinc, Zn <= 0.20 %<= 0.20 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC19720x1 / 291767

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