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Metal adhesives

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Parker Chomerics Tecknit TeckBond™-A Silver-Plated Aluminum-Filled Adhesive
Categories: Polymer; Adhesive

Material Notes: Description: TECKBOND-A conductive system is a silicone based, two-component RTV, filled with silver-plated aluminum particles. After cure, the resultant bond or seal is flexible, resilient, and conductive.

Application Information: TECKBOND-A conductive adhesive is recommended wherever a flexible bond is required in a metal to silicone gasket application, such as TECKNIT® CONSIL®-A

Information provided by Chomerics

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Mechanical PropertiesOriginal ValueComments
Shear Strength >= 0.689 MPaCured; ASTM D1002
Peel Strength >= 0.351 kN/mSilicone Aluminum; Cured; ASTM D1876
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.010 ohm-cmCured; QAP-1017
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 302 °CCured
Minimum Service Temperature, Air -55.0 °CCured
Shrinkage <= 40 %Cured
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hour
@Temperature 25.0 °C
followed by 24 hr @ 100°C
Shelf Life 9.00 MonthUnopened Container
 
Descriptive Properties
ColorBeige
ConsistencyThick Paste
FillerAg/Al
Final ConditionFlexible
Mix Ratio49:1
Number of ComponentsTwo
ResinSilicone
Volume14 in3
Weight16 oz

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PCHOME402 / 131112

Metal adhesives

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