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Master Bond adhesives

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Lord Adhesives Metech 3541 Platinum Silver Conductor Composition
Categories: Polymer; Adhesive

Material Notes: These conductor compositions employ a state of the art mixed bond frit system to enhance adhesion and conductivity values while offering a range of cost effective conductors compatible with most resistor and dielectric systems.

All information provided by Lord.

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Physical PropertiesOriginal ValueComments
Brookfield Viscosity 180000 - 220000 cP
@Temperature 25.0 °C
HBT, Spindle #SC4-14 @ 10rpm
Thickness 12.0 - 14.0 micronsFired
 
Electrical PropertiesOriginal ValueComments
Surface Resistivity per Square 0.0070 ohm
 
Processing PropertiesOriginal ValueComments
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
Adhesion3-4lbs; aged
 7-8lbs; initial
Coverage (cm²/gm)70-75Calculated from 50 micron wet film
Line Resolution (microns)125
Solder Leach Resistance (5 sec. cycles)5Cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC
Solder Wetting (seconds)< 3Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC

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PLORD079 / 86087

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