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Elmet Technologies

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Devcon High-Performance Backing Compound Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Abrasion-Resistant System

Data provided by Ellsworth Adhesives.

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Physical PropertiesOriginal ValueComments
Density 0.0581 lb/in³
Viscosity 10320 cPwith hardener
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 92ASTM D2240
Tensile Strength, Ultimate 7687 psiASTM D638
Tensile Modulus 950 ksiASTM D638
Flexural Yield Strength 11500 psiASTM D790
Compressive Yield Strength 18850 psiASTM D695
Adhesive Bond Strength 2000 psiAdhesive tensile shear strength; ASTM D1002
 
Thermal PropertiesOriginal ValueComments
CTE, linear 40.0 µm/m-°C
@Temperature 20.0 °C
ASTM D696
Maximum Service Temperature, Air 250 °FOperating Temperature
Shrinkage 0.060 %During Cure; ASTM D2566
 
Processing PropertiesOriginal ValueComments
Processing Temperature 70.0 °F
Pot Life 56.0 min
@Temperature 23.9 °C
 
Descriptive Properties
Coverage per 20.3 lb.347 in²
Mix Ratio by Volume9.95 to 1resin:hardener
Mix Ratio by Weight100 to 5.94resin:hardener

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PITWX24 / 48511

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