Cookson Group Plaskon® CMU-880-MA Molded Underfill Compound for Flip Chip BGAs and CSPs

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Cookson Group Plaskon® CMU-880-MA Molded Underfill Compound for Flip Chip BGAs and CSPs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	This material is an epoxy Molded Underfill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON CMU Series is the total molded underfill solution for Flip Chip in Package. Features: Higher Productivity Higher Tg Higher Reliability Lower Warpage Lower CTE Lower Cost of Ownership Minimum 260ºC Reflow Minimum JEDEC Level 3 Applications: Plaskon CMU-880-MA Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential. Mold Applications: Plaskon CMU-880-MA is suitable to vacuum assist molding approaches for underfilling flip chip packages. It will work in matrix, strip and singulated molds. Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	2.00 g/cc	2.00 g/cc
Moisture Absorption at Equilibrium	0.25 %	0.25 %	at 85°C/85% RH, 168 hours
Viscosity	3000 cP @Temperature 175 °C	3000 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	160 cm	63.0 in	at 175°C and 1000 psi
Ash	87.5 %	87.5 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	65	65	Cull hot
Flexural Strength	132.4 MPa	19200 psi
	12.75 MPa @Temperature 260 °C	1849 psi @Temperature 500 °F
Flexural Modulus	24.52 GPa	3556 ksi
	0.6865 GPa @Temperature 260 °C	99.56 ksi @Temperature 500 °F

Thermal Properties	Metric	English	Comments
CTE, linear	9.00 µm/m-°C @Temperature 20.0 °C	5.00 µin/in-°F @Temperature 68.0 °F	Alpha 1
	40.0 µm/m-°C @Temperature 20.0 °C	22.2 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	135 °C	275 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in

Processing Properties	Metric	English	Comments
Mold Temperature	165 - 185 °C	329 - 365 °F
Back Pressure	6.89 MPa	1000 psi
Cure Time	0.833 - 1.67 min	0.0139 - 0.0278 hour	In mold
	0.000 - 120 min @Temperature 175 °C	0.000 - 2.00 hour @Temperature 347 °F	Post mold
Gel Time	0.417 min	0.417 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Filler Shape	Spherical
Filler Size	40 µm		Maximum
	6 µm		Average
Hydrolyzable Halides	<1 ppm

**
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PPLASK084 / 56374

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