Henkel Loctite® ABLESTIK CE3920 Epoxy

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Henkel Loctite® ABLESTIK CE3920 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Cure: Heat cure Product Benefits: One component Electrically conductive Thermosetting Pb-free alternative to solder Low viscosity Low CTE No post cure required Low temperature cure Long work life Stencil or screen printable Application: Assembly Typical Assembly Applications: SMD interconnect formation and Stencil/screen printing LOCTITE ABLESTIK CE3920 is designed for dispense or printing applications and SMT assembly processes. The long work life minimizes product waste and clean-up time, providing increased production efficiency. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Viscosity	26100 cP	Cone & Plate, Angle 3º, @ Speed 5 rpm

Mechanical Properties	Original Value	Comments
Shear Strength	1.70 MPa @Temperature 250 °C	2 X 2 mm (80 x 80 mil) Si die on Ag Plated Leadframe
	22.7 MPa @Temperature 25.0 °C	After 30 seconds @ 250ºC, 2 X 2 mm (80 x 80 mil) Si die on Ag Plated Leadframe
	36.5 MPa @Temperature 25.0 °C	2 X 2 mm (80 x 80 mil) Si die on Ag Plated Leadframe

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00030 ohm-cm	sample cured 5 minutes @ 150ºC

Thermal Properties	Original Value	Comments
CTE, linear	29.0 µm/m-°C	Cured, Below Tg
	130 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	119 °C	Cured, by TMA, Sample cured , 30 mins @ 150°C, °C

Processing Properties	Original Value	Comments
Cure Time	5.00 min @Temperature 150 °C	Batch Cure
Shelf Life	6.00 Month @Temperature -40.0 °C

Descriptive Properties
Extractable Ionic Content (ppm)	0.2	Cured, Potassium (K+)
	0.6	Cured, Sodium (Na+)
	5.1	Cured, Chloride (Cl-)
Thixotropic Index	5.7	Uncured, 0.5/5 rpm

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PLOCT5114 / 255325

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