LNP THERMOCOMP DX13354X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Aesthetics, Wide Processing Window and Colorable. Features: Aesthetics and Appearance,Enhanced Ductility,Laser Direct Structuring,Circuit Solution,Colorable Information provided by SABIC |