LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive Features: High Stiffness,Light-weight Structural,High Heat Resistance,Super Strong (Carbon Fiber Filled),Electrically Conductive,Easy Molding,Structural Information provided by SABIC |