Henkel Loctite® ABLESTIK ACP 3122 Epoxy

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Henkel Loctite® ABLESTIK ACP 3122 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Golden Brown Cure: Heat cure Product Benefits: Snap curable Anisotropic electrically conductive Low temperature cure Optimized rheology Electrically conductive in the z-axis only Application: Assembly Typical Assembly Applications: Copper circuitry, Gold plated terminators and Silver ink conductive traces LOCTITE ABLESTIK ACP 3122 anisotropic, epoxy adhesive is designed for high throughput microelectronics assembly applications. This adhesive conducts only in one direction, making it suitable for small die and component attachment without the possibility of electrical shorting. LOCTITE ABLESTIK ACP 3122 requires pressure during cure to establish a reliable interconnect. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Viscosity	14000 cP @Shear Rate 30.0 1/s	14000 cP @Shear Rate 30.0 1/s
	22000 cP @Shear Rate 15.0 1/s	22000 cP @Shear Rate 15.0 1/s

Mechanical Properties	Metric	English	Comments
Tensile Modulus	0.220 GPa @Temperature 100 °C	31.9 ksi @Temperature 212 °F	Storage Modulus, DMA, Ramp Rate 3ºC/minute
	1.95 GPa @Temperature 50.0 °C	283 ksi @Temperature 122 °F	Storage Modulus, DMA, Ramp Rate 3ºC/minute
	2.40 GPa @Temperature 25.0 °C	348 ksi @Temperature 77.0 °F	Storage Modulus, DMA, Ramp Rate 3ºC/minute

Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	100 °C	212 °F	DMA, Tan ? Max

Processing Properties	Metric	English	Comments
Cure Time	0.0830 min @Temperature 150 °C	0.00138 hour @Temperature 302 °F	under optimum pressure, bondline temperature
Working Life	1440 min	1440 min
Shelf Life	3.00 Month @Temperature -20.0 °C	3.00 Month @Temperature -4.00 °F	Uncured

Descriptive Properties
Shear Strength	2.2 kg		Die, 50 x 50 mil Si die to Copper/PET

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PLOCT5046 / 255257

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