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Master Bond adhesives

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Sumitomo Bakelite EPIALL 1960B-1 Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices

Information provided by Sumitomo Bakelite High Performance Plastics (sbhpp)

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.76 g/ccASTM D792
Water Absorption 0.20 %
@Time 173000 sec
ASTM D570
Linear Mold Shrinkage 0.0030 - 0.0050 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 79.0 MPaASTM D638
Flexural Strength 114 MPaASTM D790
Flexural Modulus 12.4 GPaASTM D790
Compressive Strength 241 MPaASTM D695
Izod Impact, Notched 37.0 J/mASTM D256A
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 4.0
@Frequency 1e+6 Hz
wet; ASTM D150
Dielectric Strength >= 12.8 kV/mm
@Frequency 60 Hz
SS, wet
 >= 14.9 kV/mm
@Frequency 60 Hz
ST, wet
Dissipation Factor 0.019
@Frequency 1e+6 Hz
wet; ASTM D150
Arc Resistance 180 secASTM D495
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) 275 °CPost Baked; ASTM D648A

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