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Master Bond adhesives

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Plenco 7500 Phenolic, Granular, Compression Molded
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic; Phenolic, Novolac, Woodflour Filled

Material Notes: PLENCO 07500 is an organic reinforced phenolic molding compound, offering improved mechanical strength and excellent cosmetic characteristics. Type ASTM 5948 CFG and UL recognized under component file E40654. 07500 is available in black or red color.

Information supplied by Plenco.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Bulk Density 0.520 g/ccASTM D1895
Density 1.38 g/ccASTM D792
Water Absorption 0.49 %ASTM D570
Linear Mold Shrinkage 0.0040 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell E 92ASTM D785
Tensile Strength, Ultimate 58.0 MPaASTM D638
Elongation at Break 0.76 %ASTM D638
Tensile Modulus 9.10 GPaASTM D638
Flexural Strength 97.0 MPaASTM D790
Flexural Modulus 8.80 GPaASTM D790
Compressive Strength 219 MPaASTM D695
Izod Impact, Notched 23.5 J/mASTM D256
Charpy Impact, Notched 0.233 J/cm²ASTM D256
Impact 172J/m Drop Ball Impact; PLENCO
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.30e+12 ohm-cmASTM D247
Dielectric Constant 4.6ASTM D150
Dielectric Strength 16.7 kV/mmShort Time; ASTM D149
Dissipation Factor 0.037ASTM D150
Arc Resistance 88 secASTM D495
Comparative Tracking Index 175 VASTM D3638
 
Thermal PropertiesOriginal ValueComments
CTE, linear 61.0 µm/m-°C
@Temperature 40.0 - 130 °C
TMA; ASTM E831
Thermal Conductivity 0.360 W/m-K
@Temperature 100 °C
ASTM E1461
Maximum Service Temperature, Air 196 °CHeat Resistance; ASTM D570D
Deflection Temperature at 1.8 MPa (264 psi) 176 °CASTM D648
Flammability, UL94 HB
@Thickness 1.50 mm
Oxygen Index 25.3 %ASTM D2863
Shrinkage 0.145 %72 hr, 120ºC; ASTM D1299

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PLEM43 / 50723

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