Hexcel® Redux® 219/3-NA Foaming adhesive film

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Hexcel® Redux® 219/3-NA Foaming adhesive film
Categories:	Polymer; Adhesive; Film
Material Notes:	The Redux 200 series is a range fo foaming adhesive films presented in sheet form. They expand during the cure cycle to fill gaps and adhere strongly to all parts of the structure with which they come into contact. Redux foaming adhesive films are compative with Redux film adhesives. Features: High strength at temperatures from -67°F to 428°F; Less than 1% volatiles emitted during cure; Suitable for aluminum and fiber-reinforced composite sandwich constructions; Expansion ratios from 1:1.9 to 1:4.0. Application: Low exotherm for thicker sections. Associated Film Adhesives: Redux 319, 322, 330, 340 (SP), 641
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Mechanical Properties	Metric	English	Comments

Shear Strength	6.00 MPa @Temperature 149 °C	870 psi @Temperature 300 °F	Aluminum Double Lap Shear (0.06 inch gap)
	10.0 MPa @Temperature 22.2 °C	1450 psi @Temperature 72.0 °F	Aluminum Double Lap Shear (0.06 inch gap)

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 177 °C	1.00 hour @Temperature 350 °F	Heat up rate 10°F/min
Shelf Life	18.0 Month @Temperature -17.8 °C	18.0 Month @Temperature 0.000 °F

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PHEXC431 / 99250

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