Park Aerospace Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stability and superior hole-wall integrity. Key Features and Benefits: Outstanding Z-axis, thermal stability and hole wall integrity Automotive Testing SI (Signal Integrity) option CAF resistant Cost-effective standard FR-4 processing Applications/Qualifications: Wireless Handsets Wireless Infrastructure Digital Broadband Multilayers Automotive Underhood Automotive Backplanes Fine-Line Multilayers Fine Pitch BGA Multilayers Direct Chip Attach RoHS Compliant Meets IPC-4101/98 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
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Physical Properties	Original Value	Comments

Density	1.97 g/cc	50% Resin Content; Internal Method
Water Absorption	0.070 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Original Value	Comments
Peel Strength	7.50 pli	after solder float; IPC-TM-650.2.4.8
	8.10 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	9.00 pli	after exposure to process solutions; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
	1.00e+14 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+13 ohm	E - 24/125; IPC-TM-650.2.5.17.1
	1.00e+14 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant	3.3 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.4 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
	3.6 @Frequency 1e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
	4.0 @Frequency 1e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength	1250 V/mil	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.015 @Frequency 2.50e+9 Hz	Stripline; IPC-TM-650.2.5.5.5
	0.016 @Frequency 1e+10 Hz	Stripline; IPC-TM-650.2.5.5.5
	0.016 @Frequency 1e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Arc Resistance	124 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	6.67 - 8.33 µin/in-°F @Temperature -40.0 - 125 °C	X/Y; IPC-TM-650.2.4.41
	27.8 µin/in-°F @Temperature 50.0 - 155 °C	Z-Axis Alpha 1; IPC-TM-650.2.4.41
	150 µin/in-°F @Temperature 155 - 260 °C	Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity	0.290 BTU/lb-°F	ASTM E1461
Thermal Conductivity	3.64 BTU-in/hr-ft²-°F	ASTM E1461
Glass Transition Temp, Tg	150 °C	TMA; IPC-TM-650.2.4.24c
	155 °C	DSC; IPC-TM-650.2.4.25c
	160 °C	DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature	330 °C	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0

Descriptive Properties
Methylene Chloride Resistance (% Weight Change)	0.31	IPC-TM-650.2.3.4.3
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	16	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	3.7	50ºC to 260ºC; IPC-TM-650.2.4.41

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