Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1271 Conapoxy® Resin / Conacure® Hardener Low cost, low viscosity, low exotherm potting and casting system - convenient mix ratio.
- Mix Ratio, Resin/Hardener (by weight): 100/100
Cure Type: Room Temperature Information provided by Cytec, subsequently acquired by Elantas. |