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Master Bond adhesives

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LG Chemical LUPOY SG5009FA PC/ABS/PMMA, Halogen Free Flame Retardant  (discontinued **)
Categories: Polymer; Thermoplastic; ABS Polymer; Polycarbonate/ABS Alloy, Unreinforced; Acrylic (PMMA); Polycarbonate (PC)

Material Notes: Description: Injection Molding, PC/ABS, Halogen Free Flame Retardant, High Gloss, Anti-scratch

Application: IT&OA (Notebook PC housing)

CAS: 103598-77-2, 9003-56-9, 9011-14-7 and 181028-79-5

Information provided by LG Chemical

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.18 g/ccASTM D792
Maximum Moisture Content 0.040Injection Molding
Linear Mold Shrinkage, Flow 0.0030 - 0.0050 cm/cm
@Thickness 3.20 mm
ASTM D955
Melt Flow 20 g/10 min
@Load 2.16 kg,
Temperature 250 °C
ASTM D1238
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 680 kg(f)/cm²
@Thickness 3.20 mm
50mm/min; ASTM D638
Flexural Yield Strength 1050 kg(f)/cm²
@Thickness 3.20 mm
10mm/min; ASTM D790
Flexural Modulus 28500 kg(f)/cm²
@Thickness 3.20 mm
10mm/min; ASTM D790
Izod Impact, Notched 8.50 kg-cm/cm
@Thickness 3.20 mm,
Temperature 23.0 °C
ASTM D256
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 94.0 °C
@Thickness 6.40 mm
Unannealed; ASTM D648
UL RTI, Electrical 80.0 °C
UL RTI, Mechanical with Impact 80.0 °C
UL RTI, Mechanical without Impact 80.0 °C
Flammability, UL94 V-0
@Thickness >=1.20 mm
 
Processing PropertiesOriginal ValueComments
Rear Barrel Temperature 230 - 270 °CInjection Molding
Middle Barrel Temperature 235 - 270 °CInjection Molding
Front Barrel Temperature 235 - 270 °CInjection Molding
Nozzle Temperature 235 - 270 °CInjection Molding
Melt Temperature 245 - 270 °CInjection Molding
Mold Temperature 90.0 - 120 °CInjection Molding
Drying Temperature 75.0 - 85.0 °CInjection Molding
Dry Time 3.00 - 4.00 hourInjection Molding
Back Pressure 0.981 - 1.96 MPaInjection Molding
Screw Speed 40 - 70 rpmInjection Molding

**
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