Alloying copper into silver increases the hardness of the material, and its resistance to mechanical wear and deformation. The electrical and thermal conductivity remain relatively high, thus, the alloys retain good current switching characteristics. Corrosion resistance decreases as the copper content increases. Copper oxides and other films will increase the surface resistance of these materials. This will require higher closing forces, usually 2 ounces or more, and some wiping action to break through the films and establish good contact. Because of the oxidation tendency, the silver-copper alloys should be avoided in high temperature applications. The silver-copper alloy materials are ductile and can be made in almost all the same shape and size contacts as fine silver. Usually, they will show an economical advantage over fine silver.

ELKONIUM® 23 alloy has a tarnish resistance almost as good as fine silver and is a little harder. In low force devices, which have high inrush currents, this material has somewhat less tendency toward sticking than fine silver.

Information provided by CMW Inc.