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Master Bond adhesives

BASF Ultramid® Advanced T1000 HG7 LS BK23593 Polyphthalamide, 35% Glass Fiber Reinforced
Categories: Polymer; Thermoplastic; Polyphthalamide (PPA); Polyphthalamide (PPA), 40% Glass Fiber Reinforced

Material Notes: Ultramid Advanced T1000 HG7 LS BK23593 is a heat stabilized, partially aromatic, 35% glass fiber reinforced polyphthalamide for injection molding with strong mechanical properties especially at elevated temperatures and excellent chemical resistance for highly stressed parts. This material has high strength and stiffness, very low water absorption and outstanding dimensional stability. It features a high melting point (320C) and excellent melt stability. This grade is suitable for laser marking.

Information provided by BASF.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.485 g/cc0.05365 lb/in³ISO 1183
Moisture Absorption 1.60 %1.60 %50% RH; ISO 62
Water Absorption at Saturation 3.8 %3.8 %ISO 62
Linear Mold Shrinkage, Flow 0.0040 cm/cm0.0040 in/inISO 294-4
Linear Mold Shrinkage, Transverse 0.0093 cm/cm0.0093 in/inISO 294-4
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break  135 MPa
@Temperature 120 °C
19600 psi
@Temperature 248 °F
Dry; ISO 527
 145 MPa
@Temperature 80.0 °C
21000 psi
@Temperature 176 °F
Conditioned; ISO 527
 180 MPa
@Temperature 80.0 °C
26100 psi
@Temperature 176 °F
Dry; ISO 527
 210 MPa
@Temperature 23.0 °C
30500 psi
@Temperature 73.4 °F
Conditioned; ISO 527
 220 MPa
@Temperature 23.0 °C
31900 psi
@Temperature 73.4 °F
Dry; ISO 527
Elongation at Break  1.9 %
@Temperature 23.0 °C
1.9 %
@Temperature 73.4 °F
Conditioned; ISO 527
 2.0 %
@Temperature 23.0 °C
2.0 %
@Temperature 73.4 °F
Dry; ISO 527
 2.0 %
@Temperature 80.0 °C
2.0 %
@Temperature 176 °F
Dry; ISO 527
 2.2 %
@Temperature 80.0 °C
2.2 %
@Temperature 176 °F
Conditioned; ISO 527
 2.9 %
@Temperature 120 °C
2.9 %
@Temperature 248 °F
Dry; ISO 527
Tensile Modulus  10.0 GPa
@Temperature 120 °C
1450 ksi
@Temperature 248 °F
Dry; ISO 527
 12.0 GPa
@Temperature 80.0 °C
1740 ksi
@Temperature 176 °F
Conditioned; ISO 527
 12.5 GPa
@Temperature 80.0 °C
1810 ksi
@Temperature 176 °F
Dry; ISO 527
 14.0 GPa
@Temperature 23.0 °C
2030 ksi
@Temperature 73.4 °F
Dry; ISO 527
 14.0 GPa
@Temperature 23.0 °C
2030 ksi
@Temperature 73.4 °F
Conditioned; ISO 527
Charpy Impact Unnotched  7.00 J/cm²
@Temperature -30.0 °C
33.3 ft-lb/in²
@Temperature -22.0 °F
Dry; ISO 179
 7.00 J/cm²
@Temperature 23.0 °C
33.3 ft-lb/in²
@Temperature 73.4 °F
Dry; ISO 179
Charpy Impact, Notched  0.800 J/cm²
@Temperature -30.0 °C
3.81 ft-lb/in²
@Temperature -22.0 °F
Dry; ISO 179
 0.800 J/cm²
@Temperature 23.0 °C
3.81 ft-lb/in²
@Temperature 73.4 °F
Dry; ISO 179
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cmConditioned; IEC 60093
 >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cmDry; IEC 60093
Dielectric Strength 37.0 kV/mm940 kV/inDry; IEC 60243-1
 
Thermal PropertiesMetricEnglishComments
Melting Point 320 °C608 °FDry; ISO 3146
Deflection Temperature at 1.8 MPa (264 psi) 280 °C536 °FDry; ISO 75
UL RTI, Electrical  85.0 °C
@Thickness 0.750 mm
185 °F
@Thickness 0.0295 in
UL746B
 85.0 °C
@Thickness 3.00 mm
185 °F
@Thickness 0.118 in
UL746B
UL RTI, Mechanical with Impact  85.0 °C
@Thickness 0.750 mm
185 °F
@Thickness 0.0295 in
UL746B
 85.0 °C
@Thickness 3.00 mm
185 °F
@Thickness 0.118 in
UL746B
UL RTI, Mechanical without Impact  85.0 °C
@Thickness 0.750 mm
185 °F
@Thickness 0.0295 in
UL746B
 85.0 °C
@Thickness 3.00 mm
185 °F
@Thickness 0.118 in
UL746B
Flammability, UL94  HB
@Thickness 0.750 mm
HB
@Thickness 0.0295 in
 HB
@Thickness 3.00 mm
HB
@Thickness 0.118 in
 
Processing PropertiesMetricEnglishComments
Melt Temperature 345 - 360 °C653 - 680 °F
Mold Temperature 150 - 170 °C302 - 338 °F
Drying Temperature 120 °C
@Time 28800 sec
248 °F
@Time 8.00 hour
Moisture Content <= 0.050 %<= 0.050 %

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