Parker Chomerics CHO-SHIELD® 2054 Conductive Coating

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Parker Chomerics CHO-SHIELD® 2054 Conductive Coating
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	CHO-SHIELD® 2054 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used for electronic enclosures. Application: With their excellent leveling and uniformity, these coatings are compatible with all commercially available application technologies, including high volume/low pressure (HVLP) spray systems, and conventional propeller-agitated pressure pots. As low-settling compounds, they are ready for use after simple mixing in a paint shaker. They are supplied ready-to-spray, and don’t required additional thinning, although MEK can be used. Information provided by Chomerics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.20 - 1.60 g/cc	1.20 - 1.60 g/cc
Volatile Organic Compounds (VOC) Content	75 g/l	75 g/l
Brookfield Viscosity	1200 - 1600 cP	1200 - 1600 cP	100 rpm. spindle #3 @ 25°C; Suggested Spraying Viscosity #2 Zahn Cup
Thickness	38.0 microns	1.50 mil	Recommended

Electrical Properties	Metric	English	Comments
Surface Resistivity per Square	<= 0.030 ohm @Thickness 0.0381 mm	<= 0.030 ohm @Thickness 0.00150 in
Shielding Effectiveness	75 dB	75 dB	minus water

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	75.0 °C	167 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F

Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 24.0 °C	0.250 hour @Temperature 75.2 °F	followed by 30 min @ 65°-85°C
	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
Shelf Life	12.0 Month	12.0 Month

Descriptive Properties
Consistency	Thin Fluid
Coverage	10.4 m²/liter		0.025 mm thick
Filler	Silver plated Copper
Mix	1-part
Polymer	Water-based acrylic/urethane

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PCHOME139 / 28361

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