Low brass, UNS C24000, OSO25 Temper flat products

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Low brass, UNS C24000, OSO25 Temper flat products
Categories:	Metal; Nonferrous Metal; Copper Alloy; Brass
Material Notes:	Fair to excellent corrosion resistance. Excellent cold workability; good hot formability. The Romans called this alloy "orichalcum", which also contained trace amounts of lead, tin, and other metals and was used to strike coins. Orichalcum is also the name of a naturally occurring gold-copper alloy that is only found in the Andes Mountains of South America. Applications: battery caps, bellows, musical instruments, clock dials, pump lines, flexible hose. Test specimen: flat products - 1mm thickness.
Key Words:	80/20 brass, pump lines, flexible hose, flat products, wire, Low brass, UNS C24000, CZ103, ISO CuZn20, CEN CW503L, gilding metal, 80/20 brass, orichalcum
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Physical Properties	Metric	English	Comments

Density	8.67 g/cc	0.313 lb/in³

Mechanical Properties	Metric	English	Comments
Hardness, Rockwell F	69	69
Hardness, Rockwell 30T	32	32
Tensile Strength, Ultimate	330 MPa	47900 psi
Tensile Strength, Yield	115 MPa	16700 psi
Elongation at Break	47 %	47 %	In 50 mm
Modulus of Elasticity	110 GPa	16000 ksi
Poissons Ratio	0.375	0.375
Machinability	30 %	30 %	UNS C36000 (free-cutting brass) = 100%
Shear Modulus	40.0 GPa	5800 ksi

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.00000539 ohm-cm	0.00000539 ohm-cm	Annealed
Magnetic Susceptibility	-1.00e-6	-1.00e-6	Approximately, cgs units

Thermal Properties	Metric	English	Comments
CTE, linear	19.1 µm/m-°C @Temperature 20.0 - 300 °C	10.6 µin/in-°F @Temperature 68.0 - 572 °F
Specific Heat Capacity	0.380 J/g-°C	0.0908 BTU/lb-°F
Thermal Conductivity	140 W/m-K @Temperature 20.0 °C	972 BTU-in/hr-ft²-°F @Temperature 68.0 °F
Melting Point	965 - 1000 °C	1770 - 1830 °F
Solidus	965 °C	1770 °F
Liquidus	1000 °C	1830 °F
Annealing Point	427 - 704 °C	800 - 1300 °F

Processing Properties	Metric	English	Comments
Annealing Temperature	425 - 700 °C	797 - 1290 °F
Hot-Working Temperature	825 - 900 °C	1520 - 1650 °F
Recrystallization Temperature	400 °C	752 °F	Approximately, for 37% reduction and 0.06mm initial grain size

Component Elements Properties	Metric	English	Comments
Copper, Cu	78.5 - 81.5 %	78.5 - 81.5 %
Iron, Fe	>= 0.050 %	>= 0.050 %
Lead, Pb	>= 0.050 %	>= 0.050 %
Zinc, Zn	20 %	20 %

References for this datasheet.

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MC24000b5 / 11059

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