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Master Bond adhesives

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Sumitomo Bakelite EM 7302LD-2 Epoxy Molding Compound
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: EM 7302LD-2 is a long fiberglass reinforced epoxy molding compound with a low density inert filler. This compound is designed for applications where moderate strength and weight savings are desirable.

Information provided by Sumitomo Bakelite High Performance Plastics (sbhpp)

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.20 - 1.50 g/ccASTM D792
Water Absorption 0.29 %
@Time 173000 sec
ASTM D570
Linear Mold Shrinkage 0.0014 cm/cmASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 76.0 MPaASTM D638
Flexural Strength 214 MPaASTM D790
Flexural Modulus 17.2 GPaASTM D790
Compressive Strength 190 MPaASTM D695
Izod Impact, Notched 1240 J/mASTM D256A
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 2.8
@Frequency 1e+6 Hz
wet; ASTM 150
Dielectric Strength >= 9.30 kV/mm
@Frequency 60 Hz
ST, dry
Dissipation Factor 0.017
@Frequency 1e+6 Hz
wet; ASTM D150
Arc Resistance 120 secASTM D495
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) >= 282 °CPost Baked; ASTM D658A

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