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Master Bond adhesives

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Silver-bearing tough pitch Copper, UNS C11300, H04 Temper, Wire
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Hard

Fabrication Properties: Excellent Suitability – Soldering, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Brazing, Butt Weld; Fair Suitability – Gas Shielded Arc Welding

Common Fabrication Processes: Blanking, Coining, Coppersmithing, Drawing, Etching, Forming and Bending, Heading and Upsetting, Hot Forging and Pressing, Piercing and Punching, Roll Threading and Knurling, Shearing, Spinning, Squeezing and Swaging, Stamping

Typical uses: Spouting; Gaskets; Radiator and Heat Exchanger Fins; Radiators; Bus Bars; Commutator Bars and Segments; Conductivity Wire; Contacts; Fuse Clips; Generator Coils; Radio Parts; Switches; Terminals; Transformer Windings; Windings; Chemical Process Equipment; Clad Metals; Printed Circuit Foil; Printing Rolls

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Physical PropertiesOriginal ValueComments
Density 0.322 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 55.0 ksi
Tensile Strength, Ultimate 29.0 ksiIn Shear
Elongation at Break 1.5 %
Tensile Modulus 17000 ksi
Modulus of Rigidity 6400 ksi
Poissons Ratio 0.33Calculated
Machinability 20 %
Forgeability 65 %
Shear Strength 29.0 ksi
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000172 ohm-cm100% IACS
 
Thermal PropertiesOriginal ValueComments
CTE, linear 9.80 µin/in-°F
@Temperature 20.0 - 300 °C
Specific Heat Capacity 0.0920 BTU/lb-°F
Thermal Conductivity 224 BTU-in/hr-ft²-°F
Melting Point <= 1980 °F
Liquidus 1980 °F
Annealing Point 900 - 1400 °F
 
Processing PropertiesOriginal ValueComments
Hot-Working Temperature 1400 - 1600 °F
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu >= 99.9 %
Silver, Ag >= 0.027 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC11300x5 / 292687

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