Park Aerospace Nelco® N5000-30/32 BT Epoxy Package

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Park Aerospace Nelco® N5000-30/32 BT Epoxy Package
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco N5000-30 prepreg and N5000-32 laminate BT epoxy materials are designed specifically to meet or exceed new and emerging chippackaging requirements. The primary applications of these materials include high performance interconnects that form the circuitry inside plastic BGAs, PBGAs and LGAs. Key Features and Benefits: BT resin chemistry Excellent Reliability and Performance Chip Packaging Options Meets JEDEC Standards Wide processing latitude Applications/Qualifications: BGA Multilayers PBGA LG PCMCIA MCM-Ls Direct Chip Attach JEDEC Conforming Packages RoHS Compliant Meets IPC-4101/30 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
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Physical Properties	Original Value	Comments

Water Absorption	<= 0.050 %	IPC-TM-650.2.6.2.1

Mechanical Properties	Original Value	Comments
Modulus of Elasticity	3300 ksi	Y; ASTM D3039
	3400 ksi	X; ASTM D3039
Poissons Ratio	0.21	X; ASTM D3039
	0.21	Y; ASTM D3039
Shear Modulus	9.42 - 9.67 GPa	Calculated
Peel Strength	8.70 pli	at elevated temperature; IPC-TM-650.2.4.8.2a
	9.20 pli	after solder float; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+15 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+14 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
Dielectric Constant	4.1 @Frequency 1e+9 Hz	RF Impedance; IPC-TM-650.2.5.5.9
	4.4 @Frequency 1e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength	1750 V/mil	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.0090 @Frequency 1e+6 Hz	TFC/LCR Meter; IPC-TM-650.2.5.5.3
Arc Resistance	145 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	7.78 µin/in-°F @Temperature -40.0 - 125 °C	IPC-TM-650.2.4.41
Glass Transition Temp, Tg	205 °C	DMA (Tan d Peak); IPC-TM-650.2.4.24.3
Decomposition Temperature	344 °C	5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94	V-0

Descriptive Properties
Pressure Cooker	Pass	60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	12+	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	3.6	50ºC to 260ºC; IPC-TM-650.2.4.41

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