FM® 94 adhesive is a 220°F (104°C) service temperature, modified epoxy film adhesive designed for bonding metallic and composite structures. FM 94 adhesive offers a unique combination of high temperature performance, toughness and moisture resistance as demonstrated by its ability to bond to wet Nomex® honeycomb and retention of shear properties after pre- and post-bond humidity exposure. FM 94 adhesive is designed for applications demanding the best of both 220°F (104°C) service temperature and -67°F (-55°C) peel strength. For composite and metal bonding applications, FM 94 adhesive is formulated to exhibit superior elongation, toughness and shear strength properties. The controlled flow characteristics allow for its use in co-cured applications as well as bonding pre-cured structures. Also, FM 94 adhesive provides excellent electrical insulation between metal and graphite composites, reducing the potential for galvanic corrosion. FM 94 film adhesive is manufactured as a supported adhesive with both knit and mat carriers, or as an unsupported film. When supported with a knit carrier, optimal mechanical properties can be obtained. The random mat provides superior handling characteristics. With the mat carrier, FM 94 adhesive can be supplied in a one-side tacky (OST) version which helps reduce air entrapment when bonding large metal or composite parts. Features & Benefits: - Demonstrates superior strength in bonding both metallic and composite structures
- Provides structural performance from -67°F to 220°F (-55°C to 104°C)
- Offers exceptional elongation and toughness
- Higher service temperature version of FM® 73 film adhesive
Applications: - Bonding of metallic and composite structures
Note 1: Aluminum Substrate with BR® 6747-1 Adhesive Primer Note 2: FM 94K 0.06 psf (293 gsm) Film Adhesive after Humidity, Salt Spray and Solvent Exposure, Aluminum Substrate with BR 6747-1 Adhesive Primer Note 3: FM 94K 0.06 psf (293 gsm) Film Adhesive, Effect of Cure Cycle, Aluminum Substrates with BR 6747-1 Adhesive Prime Note 4: FM 94K 0.06 psf (293 gsm) Film Adhesive with BR 6747-1 Adhesive Primer Note 5: Effect of Humidity, Wet Nomex Bonding with FM 94M 0.06 psf (293 gsm) Film Adhesive, Immersed in water for 24 hours at 140°F (60°C) then bonded within 2 hours Note 6: Composite Substrates Co-cure Data with FM 94M 0.06 psf (293 gsm) Film Adhesive Note 7: Secondary Bonding of Epoxy/Graphite Substrates with FM 94M 0.06 psf (293 gsm) Film AdhesiveInformation provided by Cytec, subsequently acquired by Solvay. |