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Master Bond adhesives

Skybond® 700 Aromatic Polyimide Composite System
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: SKYBOND® 700 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide. It is specifically designed for structural and specialty applications where extended exposure to temperatures up to 700°F is required.

Laminate property data based on 181 glass cloth with A-1100 soft finish; thermally aged in air.

Information provided by Industrial Summit Technology Corporation.

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Physical PropertiesMetricEnglishComments
Density 1.15 - 1.18 g/cc0.0415 - 0.0426 lb/in³
Solids Content 45 - 50 %45 - 50 %
Water Absorption  0.70 %
@Thickness 3.17 mm
0.70 %
@Thickness 0.125 in
High Temp, High Pressure Laminate
 2.0 %
@Thickness 3.17 mm
2.0 %
@Thickness 0.125 in
Vacuum Bag Laminate, Uncoated
Viscosity 2500 - 7000 cP2500 - 7000 cP
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6060Vacuum Bag Laminate
 7070High Temp, High Pressure Laminate
Tensile Strength, Ultimate  347 MPa
@Thickness 3.17 mm
50300 psi
@Thickness 0.125 in
Vacuum Bag Laminate
 393 MPa
@Thickness 3.17 mm
57000 psi
@Thickness 0.125 in
High Temp, High Pressure Laminate
Elongation at Break  1.9 %
@Thickness 3.17 mm
1.9 %
@Thickness 0.125 in
High Temp, High Pressure Laminate
 2.0 %
@Thickness 3.17 mm
2.0 %
@Thickness 0.125 in
Vacuum Bag Laminate
Flexural Strength  524 - 576 MPa
@Thickness 3.17 mm
76000 - 83500 psi
@Thickness 0.125 in
Vacuum Bag Laminate
 517 - 586 MPa
@Thickness 3.17 mm
75000 - 85000 psi
@Thickness 0.125 in
High Temp, High Pressure Laminate
Flexural Modulus  19.3 GPa
@Thickness 3.17 mm
2800 ksi
@Thickness 0.125 in
Vacuum Bag Laminate
 21.5 GPa
@Thickness 3.17 mm
3120 ksi
@Thickness 0.125 in
High Temp, High Pressure Laminate
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.47e+15 ohm-cm2.47e+15 ohm-cmHigh Temp, High Pressure Laminate
Surface Resistance 3.35e+14 ohm3.35e+14 ohmHigh Temp, High Pressure Laminate
Insulation Resistance 1.90e+13 ohm1.90e+13 ohmHigh Temp, High Pressure Laminate
Dielectric Constant 4.1
@Frequency 1e+6 Hz
4.1
@Frequency 1e+6 Hz
High Temp, High Pressure Laminate
Dielectric Strength 5.51 kV/mm140 kV/inHigh Temp, High Pressure Laminate. Stepwise, parallel to laminate
 7.05 kV/mm179 kV/inHigh Temp, High Pressure Laminate. Short time, parallel to laminate
Dissipation Factor 0.00445
@Frequency 1e+6 Hz
0.00445
@Frequency 1e+6 Hz
High Temp, High Pressure Laminate
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 371 °C700 °FExtended exposure of laminate

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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