CHT AS1421-100 1-part, silicone adhesive sealant

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CHT AS1421-100 1-part, silicone adhesive sealant
Categories:	Polymer; Thermoset; Silicone
Material Notes:	Description: This is a heat cured, non-corrosive, neutral cure, 1-part, silicone adhesive sealant. It is one in a range of Addition cure products which are solvent free. It exhibits primerless adhesion to many substrates when cured at temperatures above 100°C. It cures to form a very tough resilient silicone elastomer. This product will not corrode copper or its alloys and is suitable for use with electronic components. Key Features UL94 V0 recognized in file No. E334038 Excellent thermal conductivity Fast heat cure Adhesion to most substrates Application: Electronics Cured Product: After 1 hour at 125°C Information provided by CHT Group
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Physical Properties	Metric	English	Comments

Density	2.18 g/cc	0.0788 lb/in³	BS ISO 2781
Brookfield Viscosity	140000 - 240000 cP	140000 - 240000 cP	Mixed
Storage Temperature	-5.00 - 10.0 °C	23.0 - 50.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	56	56	ASTM D2240-95
Tensile Strength	2.20 MPa	319 psi	ISO 37
Elongation at Break	105 %	105 %	ISO 37

Electrical Properties	Metric	English	Comments
Volume Resistivity	3.50e+13 ohm-cm	3.50e+13 ohm-cm	ASTM D-257
Dielectric Strength	>= 18.0 kV/mm	>= 457 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	195 µm/m-°C	108 µin/in-°F
Thermal Conductivity	2.10 W/m-K	14.6 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	210 °C	410 °F
Minimum Service Temperature, Air	-50.0 °C	-58.0 °F

Processing Properties	Metric	English	Comments
Cure Time	16.0 min @Temperature 100 °C	0.267 hour @Temperature 212 °F
Shelf Life	12.0 Month	12.0 Month

Descriptive Properties
Appearance	Grey paste
Color	Grey
Cure type	Addition Heat Cure
Rheology	Paste
Self Bonding	Yes
Volume Coefficient of Thermal Expansion	586 ppm/°C

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PCHTSIL008 / 314491

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