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Metal adhesives

Master Bond EP3HTSDA-1 One component, electrically conductive, die attach epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Key Features:
  • Low volume resistivity
  • Ideal dispensing profile
  • Not premixed and frozen
  • Very long open time at ambient temperatures
  • Cures rapidly at 250-300°F
  • Outstanding retention of conductivity
Master Bond EP3HTSDA-1 is a fast curing, one part, conductive epoxy system primarily for die attach applications. It is not premixed and frozen and has an unlimited working life at room temperature. For storage, simple refrigeration is fine. It is very fast curing. EP3HTSDA-1 dispenses smoothly and easily, without any "tailing." It is well suited for automatic dispensing equipment and can be applied to a defined area without flowing. After curing, it has excellent die shear strength. It has superior dimensional stability and can withstand thermal cycling and shock. The temperature range extends from -80°F to +400°F. It bonds well to metals, ceramics, silicon dies and many other substrates. The thermal conductivity is remarkably high, over 40-45 BTU•in/(ft²•hr•°F) [5.7-6.5 W/(m•k)]. This is substantially higher than other silver conductive epoxies. Also, it passes NASA low outgassing specifications. The extraordinary combination of convenient storage, easy handling and highly desirable properties make this a must go-to material for die attach applications. Its handling and performance properties allow it to be used in many other applications besides die attaching, both in electronic and other high-tech applications where the properties mentioned previously are desirable.

Product Advantages:

  • Single component system; no mixing needed
  • Not premixed and frozen; unlimited working life at room temperature
  • Ideal viscosity and flow for die attach
  • Impressive thermal conductivity
  • Excellent die shear strength and dimensional stability
  • NASA low outgassing
  • Available in syringes that are compatible with automatic dispensing equipment

Information provided by Masterbond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Specific Gravity 3.20 g/cc3.20 g/cc
Solids Content 100 %100 %
Viscosity >= 400000 cP>= 400000 cPthixotropic
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 75 - 8575 - 85
Tensile Strength 41.4 - 48.3 MPa6000 - 7000 psi
Tensile Modulus 2.07 - 2.41 GPa300 - 350 ksi
Adhesive Bond Strength 12.4 - 13.8 MPa1800 - 2000 psilap shear, Al/Al
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.0010 ohm-cm<= 0.0010 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 24.0 - 28.0 µm/m-°C13.3 - 15.6 µin/in-°F
Thermal Conductivity 5.70 - 6.50 W/m-K39.6 - 45.1 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C400 °F
Minimum Service Temperature, Air -62.2 °C-80.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  5.00 - 10.0 min
@Temperature 149 °C
0.0833 - 0.167 hour
@Temperature 300 °F
This time and temp, plus 1 hour at 125-150°C is an optimum cure schedule
 20.0 - 30.0 min
@Temperature 121 °C
0.333 - 0.500 hour
@Temperature 250 °F
This time and temp, plus 1 hour at 125-150°C is an optimum cure schedule
Shelf Life 3.00 - 6.00 Month3.00 - 6.00 Monthin original, unopened containers
 
Descriptive Properties
Colorsilver
Die Shear Strength20-22 kg-f(2 x 2 mm [80 x 80 mil])
Thixotropic Index3.05
Typical die size4-400 mm2

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PMASTM701 / 233758

Metal adhesives

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