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Master Bond adhesives

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Henkel Hysol MA 557 Core Splice Adhesive
Categories: Polymer; Adhesive; Film; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Modified epoxy foaming adhesive that may be cured at 250°F / 121°C or 350°F / 177°C. Designed to seal, splice or reinforce honeycomb materials. Excellent slump resistance, medium tack, nonmetallic.

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Physical PropertiesOriginal ValueComments
Storage Temperature -18.0 °C
 
Mechanical PropertiesOriginal ValueComments
Adhesive Bond Strength 7.30 MPa
@Temperature 121 °C
tube shears
 8.20 MPa
@Temperature 25.0 °C
tube shears
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 177 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 177 °C
 1.50 hour
@Temperature 121 °C
 
Descriptive Properties
Out-Time (days)10at 25°C
 5at 32°C

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PHENK863 / 146868

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