Parker Chomerics CHO-BOND® 1030 Conductive Silicone Gasket Adhesive

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Parker Chomerics CHO-BOND® 1030 Conductive Silicone Gasket Adhesive
Categories:	Polymer; Adhesive; Thermoset; Silicone
Material Notes:	Electrically conductive one-component silicone-based RTV adhesive which greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. This adhesive cures on exposure to moisture in air, contains no acetic acid or other corrosive curing agents, and is workable for up to 30 minutes after exposure to moist air. Information provided by Chomerics
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Physical Properties	Metric	English	Comments

Specific Gravity	3.50 - 4.00 g/cc	3.50 - 4.00 g/cc
Volatile Organic Compounds (VOC) Content	151 g/l	151 g/l
Thickness	30.0 microns	1.18 mil	Recommended

Mechanical Properties	Metric	English	Comments
Shear Strength	>= 1.38 MPa	>= 200 psi	Lap

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.050 ohm-cm	<= 0.050 ohm-cm	DC

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Cure Time	10100 min @Temperature 23.0 °C	168 hour @Temperature 73.4 °F
Working Life	30.0 min	30.0 min
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties
Binder	Silicone
Consistency	Gritty paste
Coverage	18.5 cm² / g
Filler	Ag/Cu
Mix Ratio	1-part

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