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Brewer Science WaferBOND HT-10.10 Temporary Bonding Material
Categories: Other Engineering Material

Material Notes: WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment.

Capabilities:

  • Process ultrathin wafers in temperatures up to 220°C
  • Protect the wafer edge from chipping
  • Protect circuitry from harsh chemical etchants
  • Provide a void-free interface for a smooth surface on the final thinned wafer
  • Debonding with the WaferBOND® HT System
  • The WaferBOND® HT coating is mechanically debonded by heating the processed wafer until the carrier can be slid from the ultrathin wafer.

    Information provided by Brewer Science.

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Physical PropertiesOriginal ValueComments
Viscosity 100000 cP
@Temperature 250 °C
Melt Viscosity
 1.00e+6 cP
@Temperature 150 °C
Melt Viscosity
 1.40e+10 cP
@Temperature 50.0 °C
Melt Viscosity
Brookfield Viscosity 1020 cP
@Temperature 37.8 °C
 1840 cP
@Temperature 25.0 °C
Thickness 10.0 micronsSpin Speed 2400 rpm
 16.0 micronsSpin Speed 1400 rpm
 56.0 micronsSpin Speed 400 rpm
Storage Temperature 16.0 - 26.0 °C

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PBREW997 / 193513

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