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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Lucas-Milhaupt PREMABRAZE® 409 Gold-Copper Braze Alloy
Categories: Metal; Nonferrous Metal; Precious Metal; Gold Alloy; Solder/Braze Alloy

Material Notes: Premabraze 409 can be used on any of the common nickel, molybdenum and iron base heat resistant alloys. Because of its low penetration of the base metal, it is well suited for brazing of thin sections, such as thin wall tubing or electronic vacuum devices. Premabraze 409 is readily used in brazing of nickel-cobalt-iron alloys and metallized ceramics. Premabraze 409 is a modified gold-copper alloy. The addition of nickel renders this alloy somewhat more sluggish in flow characteristics but improves wettability on ferrous alloys. Premabraze 409 is generally used in reducing, vacuum, or inert atmosphere. It is a more ductile, low vapor pressure alloy than standard gold-copper alloys. The composition of the alloy allows for use in applications where braze filler metals low in volatile constituents are required.

Available forms: Wire, strip, engineered preforms, specialty preforms, powder and paste.

Information provided by Lucas-Milhaupt.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 15.9 g/cc
Density 0.575 lb/in³
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000187 ohm-cm9.2% IACS
 
Thermal PropertiesOriginal ValueComments
Melting Point 1670 - 1697 °F
Solidus 1670 °F
Liquidus 1697 °F
 
Processing PropertiesOriginal ValueComments
Processing Temperature 1670 - 1797 °FBrazing Range
 
Component Elements PropertiesOriginal ValueComments
Cadmium, Cd <= 0.0010 %
Carbon, C <= 0.0050 %
Copper, Cu 15.72 - 17.22 %Remainder
Gold, Au 81 - 82 %
Lead, Pb <= 0.0020 %
Nickel, Ni 1.75 - 2.25 %
Other, each <= 0.0010 %High vapor pressure elements.
Other, total <= 0.010 %high vapor pressure elements (Including zinc, cadmium, and lead)
 <= 0.010 %Impurity elements
Phosphorus, P <= 0.0020 %
Zinc, Zn <= 0.0010 %
 
Descriptive Properties
ColorGold Gray

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NLUCM9833 / 254778

solder replacement adhesives

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