ASI® MP 5430 Epoxy Adhesive

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ASI® MP 5430 Epoxy Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	MP 5430 is a two part unfilled epoxy adhesive designed for ceramics and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was formulated to a 1:1 mix ratio for use in either MMD equipment or side by side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20-30 minutes, with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. Information provided by Adhesive Systems, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.15 g/cc	part B
	1.16 g/cc	part A
	1.16 g/cc	mixed
Viscosity	12000 cP	part A
	12500 cP	mixed
	13000 cP	part B

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Elongation at Break	3.0 - 5.0 %
Adhesive Bond Strength	2300 psi	Lap Shear; Al to Al

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 8.00e+14 ohm-cm
Dielectric Constant	4.5 @Frequency 100 Hz, Temperature 25.0 °C
Dielectric Strength	410 V/mil

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	130 °C
Minimum Service Temperature, Air	-40.0 °C

Processing Properties	Original Value	Comments
Pot Life	20.0 - 30.0 min	20 grams
Shelf Life	12.0 Month	In unopened container

Descriptive Properties
Color / appearance	clear
Mix Ratio	1 to 1 by weight or volume

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PASINC9084 / 233451

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