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Master Bond adhesives

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Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.08 g/ccPart B
 1.12 g/ccPart A
Particle Size <= 20 µm
Viscosity 1800 - 3300 cP
@Temperature 23.0 °C
100 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75
Tensile Modulus 1223 psiStorage
Shear Strength 500 psiLap
 >= 1020 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 2.50e+10 ohm-cm
Dielectric Constant 5.1
@Frequency 1000 Hz
Dissipation Factor 0.091
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 74.0 µm/m-°CBelow Tg
 236 µm/m-°CAbove Tg
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg <= 30.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 401 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hour
@Temperature 65.0 °C
 24.0 hour
@Temperature 23.0 °C
Pot Life 35 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorClear/ColorlessPart B
 TanPart A
ConsistencySlightly thixotropic paste
Mix Ratio by Weight10:6
Number of ComponentsTwo
Weight Loss0.05%200°C
 0.18%250°C
 0.63%300°C

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Celanese CoolPoly® E8101 Thermally Conductive Thermoplastic Elastomer

PPOXYT113 / 141152

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