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Master Bond adhesives

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Skybond® 800 Aromatic Polyimide Two Stage Resin
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: Two-stage cure polyimide resin that when used in prepreg applications allows the manufacture of very low void level composites by autoclave processing (<0.5% voids), combined with excellent thermal stability.

Information provided by Industrial Summit Technology Corporation.

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Physical PropertiesOriginal ValueComments
Solids Content 41 - 43 %
Viscosity 500 - 2000 cP
@Temperature 250 °C
Melt
 
Thermal PropertiesOriginal ValueComments
Glass Transition Temp, Tg 295 - 305 °CResin

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PISTEC990 / 183052

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