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Master Bond adhesives

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Materion Copper Beryllium Alloy 165 Cold Rolled (Heat Treatable) Strip AT (TF00) (UNS C72900)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Alloy 165 strip provides strength and conductivity close to Alloy 25 strip, with slightly less beryllium. Since it is heat treated after forming, it provides excellent formability and ductility. This alloy features good stress relaxation resistance and high fatigue strength. Typical applications include pressure sensor bellows, burn-in and test socket contacts, computer processor socket contacts, and electromagnetic shielding gaskets.

Information provided by Materion.

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Physical PropertiesOriginal ValueComments
Density 0.304 lb/in³
 
Mechanical PropertiesOriginal ValueComments
Hardness, Vickers 325 - 373DPH Hardness
Tensile Strength, Ultimate 150 - 180 ksi
Tensile Strength, Yield 130 - 165 ksi
@Strain 0.200 %
Elongation at Break 3.00 - 20.0 %
Modulus of Elasticity 19000 ksi
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000610 - 0.00000780 ohm-cm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 9.70 µin/in-°F
Thermal Conductivity 105 W/m-K
Melting Point 870 °C
 
Component Elements PropertiesOriginal ValueComments
Beryllium, Be 1.60 - 1.85 %
Co + Ni >= 0.200 %
Co + Ni + Fe <= 0.600 %
Copper, Cu 97.55 - 98.2 %

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