Appearance: Transparent Cure: Heat cure Product Benefits: - Non-conductive
- Fast cure
- Thin bondline
- Excellent gap filling ability
- Excellent MSL 260ºC performance
Application: Die attach Filler Type: Silica Typical Package Application: Die to die stack Carrier Type: Polyolefin LOCTITE ABLESTIK ATB 110U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability. Information provided by Loctite® |