Hipscon™ B-515 is a carbon black-filled, Polystyrene compound available in compound form. Hipscom™ B-515 compound maintains extremely low gloss surfaces after molding, allowing for easy reading of package contents via automated sensors. Features: - High degree of stiffness
- Consistent, permanent ESD protection
- Humidity independent
Applications: - Electronic component packaging and handling trays
- Material handling boxes and bins
Data provided by Noveon, Inc. |