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Master Bond adhesives

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Asahi Kasei Leona™ 94N05 Polyamide 66, MF reinforced and Heat Stabilized
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 66 (PA66)

Material Notes: Applications: Automotive parts, electrical & electronic parts, parts for office furnishings.

Information provided by Asahi Kasei Corp.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.17 g/ccDry as Molded; ASTM D792
Density 1.17 g/ccDry as Molded; ISO 1183
Moisture Absorption at Equilibrium 2.2 %
@Temperature 23.0 °C
50% RH; ISO 62
 2.2 %
@Temperature 23.0 °C
50% RH
Linear Mold Shrinkage, Flow 0.010 - 0.020 cm/cmAsahi Kasei
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 85Dry as Molded; ISO 2039
Hardness, Rockwell R 120Dry as Molded; ISO 2039
Tensile Strength 57.0 MPaConditioned at 50% RH; ASTM D638
 90.0 MPaDry as Molded; ASTM D638
Tensile Strength, Yield 58.0 MPaConditioned at 50% RH; ISO 527
 88.0 MPaDry as Molded; ISO 527
Elongation at Break >= 100 %Conditioned at 50% RH; ISO 527
Elongation at Yield 4.0 %
@Temperature 23.0 °C
Dry as Molded; ISO 527
 20 %
@Temperature 23.0 °C
Conditioned at 50% RH; ISO 527
Tensile Modulus 1600 MPaConditioned at 50% RH; ISO 527
 3500 MPaDry as Molded; ISO 527
Flexural Modulus 1500 MPaConditioned at 50% RH; ISO 178
 3200 MPaDry as Molded; ISO 178
Izod Impact, Notched 40.0 J/mDry as Molded; ASTM D256
 50.0 J/mConditioned at 50% RH; ASTM D256
Charpy Impact, Notched 5.00 kJ/m²Dry as Molded; ISO 179
 9.00 kJ/m²Conditioned at 50% RH; ISO 179
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 255 °CDry as Molded; ISO 75
Deflection Temperature at 1.8 MPa (264 psi) 75.0 °CDry as Molded; ISO 75
Flammability, UL94 HB
@Thickness 0.750 mm
Dry as Molded
Oxygen Index 28 %Dry as Molded; ASTM D2863

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PASAHI8154 / 221181

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