Hexcel® HexBond™ ST1035, 300 g/m2 Unsupported Epoxy Film Adhesive

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Hexcel® HexBond™ ST1035, 300 g/m2 Unsupported Epoxy Film Adhesive
Categories:	Polymer; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Description: HexBond™ ST1035 adhesive film is a 120oC/248oF cure modified epoxy film supported (moisture-resistant polyester carrier) or unsupported. Standard areal weights are 150, 250 and 300 g/m2. 75, 100, 200, 400 and 450 g/m2 films are also available on demand. Designed for the manufacture of sandwich structures from a various types of skins and cores and for bonding a wide range of substrates (metals, plastics, reinforced plastics and composite structures, marble, etc.). Features: Excellent balance between peel and shear in the range of -55oC/67oF to 120oC/248oF Very flexible cure temperature from 90oC/194oF to 160oC/320oF and processing methods (press, oven or autoclave) Good tack for easy adhesive joint assembly Applications: Sandwich construction Metal-to-metal bonding Composite-to-composite bonding Metal-to-composite bonding Information provided by Hexcel Corporation.
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Mechanical Properties	Metric	English	Comments

Adhesive Bond Strength	18.0 MPa @Temperature 70.0 °C	2610 psi @Temperature 158 °F	Lap Shear, 70°C 85% RH (1000h)
	19.0 MPa @Temperature 120 °C	2760 psi @Temperature 248 °F	Lap Shear
	31.0 MPa @Temperature 22.8 °C	4500 psi @Temperature 73.0 °F	Lap Shear, 70°C 85% RH (1000h)
	37.0 MPa @Temperature 70.0 °C	5370 psi @Temperature 158 °F	Lap Shear
	43.0 MPa @Temperature 22.8 °C	6240 psi @Temperature 73.0 °F	Lap Shear

Processing Properties	Metric	English	Comments
Shelf Life	24.0 Month @Temperature -18.0 °C	24.0 Month @Temperature -0.400 °F

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PHEXCB9273 / 322429

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